Step into the smart cockpit experience zone, and a seamless in-vehicle visual experience unfolds at once. The digital instrument panel clearly presents all core vehicle data for driving reference; the HUD accurately projects key information, allowing drivers to access navigation routes and safety alerts without lowering their heads, effectively safeguarding driving safety. The central control screen delivers sharp display and lag-free transmission with smooth operational connection; the passenger entertainment screen features exquisite image quality and smooth playback, providing high-quality in-vehicle entertainment for passengers. The electronic exterior rearview mirrors process images through AI algorithms for clear display and high real-time transmission, effectively eliminating driving blind spots and enhancing driving safety in extreme weather such as rainy and foggy days.

This smart cockpit solution is one of the systematic solutions ESWIN Computing brought to AWE 2026.

AWE 2026 – the China Home Appliances and Consumer Electronics Expo, themed "Smart AI, Smarter Future" – was held in Shanghai from March 12 to 15. As a benchmark exhibition in the global consumer electronics and smart home sector, this year’s expo gathered hundreds of leading enterprises worldwide, showcasing the cutting-edge trends of integration between smart technology and life scenarios.

ESWIN Computing participated in the expo with its RISAA ecosystem & technology platform and scenario-based solutions for human-machine interaction (HMI), smart home, intelligent computing, and automotive. Relying on the "edge, cloud, terminal" scenario layout of the RISAA Platform, the company demonstrated its full-stack collaboration capabilities under the RISC-V+AI technology roadmap, empowering ecological partners to conduct collaborative innovation and jointly boost the development and ecological prosperity of the RISC-V industry.

At the expo site, ESWIN Computing showcased a diverse array of terminal applications and tailored solutions for TPV AOC gaming monitors, TINECO floor washers, DAIKIN wire controllers, ZSpace AI NAS, and FANLIN AI companion robots. Leveraging innovative technologies and a robust portfolio of chips and solutions, ESWIN Computing empowers its customers and partners to accelerate the commercialization and mass rollout of their products.

In the human-machine interaction scenario, ESWIN Computing presented products including display driver ICs, timing controller ICs, and touch ICs, which boast technical advantages such as high-speed display interfaces, advanced image quality processing, and ultra-low power consumption. On-site experiences allowed customers and consumers to experience clearer, smoother, more energy-efficient and stable terminal products such as TVs, monitors, laptops and mobile phones.

Notably, ESWIN Computing’s RISC-V flexible OLED underwater touch solution won the 2026 AWE Award by virtue of groundbreaking innovation. The solution enables underwater touch control through an innovative scanning method and AI algorithms, fully demonstrating ESWIN Computing’s technical strength and innovation capabilities.

In the smart home scenario, targeting home office, home entertainment and daily home life, ESWIN Computing presented RISC-V+AI-based products and solutions including edge computing SoCs, Wi-Fi modules, RF chips, MCUs and MNT Scalers. These offerings empower the digital transformation and intelligent upgrading of smart homes, ushering in a new era of whole-house smart living.

In the intelligent computing scenario, ESWIN Computing exhibited RISC-V-based multi-form factor hardware and system solutions for cloud computing and edge computing, covering acceleration cards, cloud desktop solutions, on-premises deployment of large AI models, smart park computer vision systems, and 50-channel video analysis and smart classroom analysis systems. Driven by cloud-edge intelligence, the solutions facilitate the intelligent upgrading of application scenarios such as data centers, cloud office, large AI models, smart parks and smart education.

In the automotive scenario, an immersive smart cockpit demo showcased ESWIN Computing’s chips and solutions for smart cockpits, including CMS SoCs, SerDes, HUD modules, MCUs, PMICs, Touch ICs and LTDDI chips. These products are applied to electronic exterior rearview mirrors, in-vehicle head-up displays, in-vehicle instrument panels, central control systems, passenger displays and in-vehicle wireless chargers, demonstrating the reliability and technical advantages of ESWIN Computing’s RISC-V automotive-grade chips and solutions from multiple perspectives.

In the future, ESWIN Computing will continue to deepen RISC-V+AI technological innovation, constantly improve the RISAA ecosystem & technology platform, and further optimize its product layout across diverse application scenarios. The company will expand collaborative cooperation with industry chain partners, and integrate cutting-edge chip technology into daily consumer life with innovative technologies, chips and solutions. It will deliver a superior smart experience for users and inject a steady stream of chip-driven momentum into the upgrading of the consumer electronics industry and the high-quality development of the digital economy.