From March 10 to 12, 2026, Embedded World 2026, the world’s flagship event for the embedded industry, held in Nuremberg, Germany. As a provider of RISC-V oriented chip product, ESWIN Computing showcased its latest RISC-V innovations at the show, reaffirming its unwavering commitment to deepening its layout in the RISC-V track and forging ahead with global market expansion.

At the exhibition, ESWIN Computing highlighted chips and solutions for three key application scenarios: edge computing, smart devices, and automotive, fully presenting the implementation capabilities of RISC-V technology in embedded scenarios. In the edge computing segment, the EIC77 series products were on display, covering a diverse range of forms including development boards, AI Boxes, AI PCs and acceleration cards, which can be widely applied to smart parks, smart education, robotics and other scenarios. For smart devices, ESWIN Computing presented RISC-V-based solutions for touch control, multimedia and wireless connectivity, including underwater touch control chips, MNT Scalers and Wi-Fi/BLE SoCs, meeting the application needs of various terminal products. In the automotive segment, a "four-in-one" display format was adopted to showcase a comprehensive suite of solutions, integrating RISC-V SoCs dedicated to electronic rearview mirrors, SerDes, automotive-grade MCUs, in-vehicle touch control chips, in-vehicle LTDDI chips, in-vehicle PMICs and other products. This multi-dimensional display demonstrated the application of the products in smart cockpit and body control scenarios such as central control, passenger side, instrument panels and electronic rearview mirrors, bringing an intuitive product experience to the audience.

Embedded technology is the cornerstone of RISC-V development, and RISC-V represents the future of embedded innovation. As the core carrier for edge-side AI implementation, the low power consumption and high real-time performance requirements of embedded systems are highly aligned with the open, flexible and high energy efficiency characteristics of RISC-V. The deep integration of the two is a crucial path to drive the intelligent upgrading of the embedded industry, and also one of the core directions for the practical application of the RISC-V architecture. Driven by open architecture and scalability, RISC-V will further expand its application scenarios in the embedded field in the future, delivering multiple values to the industrial ecosystem. The chips and solutions displayed by ESWIN Computing at the exhibition are a testament to the implementation value and extension potential of RISC-V in the embedded domain.

ESWIN Computing engaged deeply with the global embedded industry

In the future, ESWIN Computing will continue to focus on technological innovation, product R&D, application promotion and ecosystem co-construction, further deepen the integration of RISC-V and embedded technologies in the AI era, collaborate with overseas partners to drive the innovative application of RISC-V in embedded scenarios, strengthen global ecological synergy, and jointly build a new open and win-win ecosystem for the embedded industry.